Soldering with No Clean Flux is a practical choice for removing the tiresome message solder cleansing making use of expensive and also polluting CFC solvent cleaning.

To get rid of cleaning, the flux and also soldering procedure need to:

• Bind properly to make audio solder joints
• Leave very little quantity of residue after soldering
• Have left over residue which is translucent, cosmetically appropriate and non-tacky that will certainly not conflict in any type of in-circuit screening, automated pin screening or bed-of-nails screening.
• Have actually left over residue that will not react with the circuit or elements as well as will remain inert and also not be affected by adjustments in temperature, humidity or variations in voltage.
• Be economic and also virtually possible.

We offer specially developed no-clean changes that satisfy the above conditions, and are suitable for a range of applications.

No Clean Flux are low solid (much less than 5%) fluxes, specifically created for SMDs and mixed innovation soldering. They are completely non-halide, show impressive solderability on all types of board including SMDs, provide outstanding wetting on surface placed elements, and also leave no visible flux deposit after soldering. Commonly no additional cleansing is needed, however if very high ionic tidiness is required, the residue can be gotten rid of by solvent or saponification cleaning. These fluxes are J-STD-004 compliant.

No Clean fluxes with solid web content much less than 3% are also available for usage in foam flux operations in addition to application by dipping, brushing or spraying.

Those with solid web content much less than 2.2% have actually been established to fulfill industry's demand for high speed automation and also high dependability. The small amount of residue is non-corrosive (fulfills IPC and also J STD requirements) and also tack cost-free (fulfills Bell Core requirements).

We likewise have a reduced solid-2%- flux, that is halide cost-free, no-resin, no rosin flux, for soldering via hole, mixed technology, surface place and also solar panel assemblies. It can be used by spray, dip as well as foam tools. It meets ANSI/ IPC SF-818 Assembly Course 3, SIR needs.